Gluing for particleboards
Up to 15% resin savings in the particleboard industry compared to common blender technology
Less humidity might result in a reduction of press factor
Standard glue pumps can be used – no additional equipment needed
Two fast-rotating spike rollers ensure homogeneous particle distribution
Special component nozzles for low-pressure gluing
Compressed air as atomization mediumn)
Internal cleaning units: swiveling plates and rotating scraper with wire rope
All parts in contact with resinated particles are stainless steel
Each nozzle is flow controlled and automatically cleaned
Integrated transport device to move the blending chute into maintenance position
EVOjet P: PB production with less glue consumption