EVOjet P


Gluing for particleboards

Customer benefits

Up to 15% resin savings in the particleboard industry compared to common blender technology
Standard glue pumps can be used – no additional equipment needed
Less humidity might result in a reduction of press factor

Technical features

Two fast-rotating spike rollers ensure homogeneous particle distribution
Compressed air as atomization medium
All parts in contact with resinated particles are stainless steel
Integrated transport device to move the blending chute into maintenance position
Special component nozzles for low-pressure gluing
Internal cleaning units: swiveling plates and rotating scraper with wire rope
Each nozzle is flow controlled and automatically cleaned
Technical drawing EVOjet P
EVOjet P

We look forward to your inquiry.

Send us a message and provide your contact details. We'll get in touch with you.

Send us your message via the contact form or find your personal contact by using the filter option. We’re looking forward to get in touch with you.

More ways to help you move forward